Plasma Ruggedized Solutions - Potting/Encapsulating
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Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - ISO 9001:2000

 Conformal Coating - Plasma Etchback - Potting - Encapsulation
  
 
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Potting/Encapsulating


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Potting can ruggedize for extreme environments, provide protection against shock and vibration, ensure security of sensitive designs, as well as create a barrier against moisture, fungus, dust, and corrosion. Potting can also enhance circuit reliability by eliminating leakage from high voltage circuits, protecting against voltage arcs and short circuits and by preventing the formation of “tin whiskers.” Plasma Ruggedized Solutions offers a variety of encapsulants. Potting or Encapsulating a circuit can make it FIPS compliant. Because Potting and Encapsulating encloses the entire assembly, the assembly is protected from unauthorized entry, modification and reverse engineering. Any attempt to remove the protective material will destroy the circuit in the process. Potting/Encapsulating a sensitive design is the perfect way to ensure its security.

Potting with Plasma Ruggedized Solutions means...
  • Custom process development
  • Both shell enclosures and non-enclosure (fence/fill) applications
  • FIPS capabilities
  • AQMD compliant
  • RoHS compliant

Plasma Ruggedized Solutions is your Potting/Encapsulating source. We can do any quantity, from first articles to large production quantities. We visually inspect each and every assembly that arrives and, if necessary, clean the assemblies that do not meet our specification for surface cleanliness. We use custom plasma processes to clean the assemblies to ensure uniform adhesion. We then use our engineering expertise to select the proper encapsulant and develop a custom procedure to perform the encapsulation. We can do ‘fence and fill’ encapsulations in the event that only part of an assembly needs to be encapsulated. Once the encapsulant has cured, we rigorously inspect each assembly using our inspection equipment.

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Potting---Encapsulation

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 Specifications  Equipment List  

Protects Against

Chemicals
Corrosion
Dust & Dirt
Electrical Arcs
EMI/RFI
Extreme temperatures
Fungus
High Altitudes
Mechanical Damage/Abrasion
Mechanical Wear
Moisture
Solder joint Stress
Temperature changes
Tin whiskers
Vibration

Available Fills

AR (Acrylic Resins)
ER (Epoxy Resins)
SR (Silicone Resins)
UR (Urethane Resins)

Industries Served

Aerospace
Audio
Automotive
Banking & Finance
Computer
Electronic
GPS
Industrial
Medical
Military
Scientific
Security
Sports & Outdoor
Telecommunications

Compliances

AQMD
COMSEC
FIPS 140-2
ISO9001
RoHS

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