Plasma Ruggedized Solutions - Plasma Etchback & Desmear
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Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - ISO 9001:2000

 Conformal Coating - Plasma Etchback - Potting - Encapsulation
  
 
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Plasma Etchback & Desmear


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‘Desmear’ uses chemical reactions to clean epoxy resin from the inside of drilled holes in PCBs. Etchback is a similar process, but rather than just removing residue, it actually removes some of the substrate surrounding the interconnects. Both of these processes ensure that good electrical contact is made between the interconnects and the through-plating, to insure circuit reliability.

Plasma Ruggedized Solutions has been servicing PCB manufacturers since 1990, with plasma gas treatment to etch and desmear drilled holes to .001”. Results are repeatable via computer control and are completely verifiable. Plasma desmear has proven to be a cleaner and superior process than using hazardous chemicals. It also eliminates health and disposal issues. The process is low temperature, and completely controllable. You get a superior result because plasma etching is more effective than chemical etching and produces an atomically clean surface without residue, providing greater wettability.

Processes established for:
  • GETEK®
  • TEFLON®
  • NELCO 13®
  • KAPTON®
  • SPEEDBOARD C®
  • POLYIMIDE®

Advantages Over Liquid Chemistry
  • Accurate – Computer Controlled
  • Consistent & Repeatable
  • Economical
  • Eliminates entire wet process
  • Fast
  • Flexible – Plasma can etch any epoxy
  • Highly Efficient
  • Highly Uniform – ‘Push-Pull’ system ensures uniformity
  • Safe – no hazardous chemicals



 Specifications  Equipment List  

Range

0.003" - 0.0002"

Workable Materials

Getek ®
Kapton ®
Nelco 31 ®
Polyimide ®
Speedboard C ®
Teflon ®

Industries Served

Computer
Electronic
Industrial
Medical
Military
Scientific
Telecommunications

Compliances

AQMD
ISO9001
MILS I-5110
RoHS

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