Plasma Ruggedized Solutions - Engineering Design & Prototyping
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Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - ISO 9001:2000

Conformal Coating - Plasma Etchback - Potting - Encapsulation
 
 
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Engineering Design & Prototyping



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Protecting a circuit or assembly from harsh environments can be very difficult, and that is why Plasma Ruggedized Solutions offers engineering and design services at every step of the design process. We will select the ideal material, coating thickness and application method for every circuit board that we get. We can develop custom processes to selectively coat certain parts of a board. In addition, we can provide information on PCB fabrication, circuit assembly and component choices to achieve a better final result.

Just as design engineers select components and develop layouts of products, we engineer processes to protect products from the environment that they will operate in. We have a wealth of knowledge and experience related to material selection, coating coverage and methodologies to secure proprietary designs and intellectual property. Whether a design needs to be ruggedized for its environment or needs to conform to a security specification, we have the necessary expertise.


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