Ball Grid Array Underfill Plasma Ruggedized Solutions BGA San Jose Huntington Beach CA

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	Ball Grid Array Underfill

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Plasma Ruggedized Solutions can under-fill any Ball Grid Array (BGA) components with a variety of encapsulants. This under-fill serves two primary purposes. The main purpose is to provide a strong mechanical bond between the BGA component and the corresponding connection to the circuit board, so that the solder joints are protected from mechanical stress. Second, the under-fill material can aid the transfer of heat from the BGA component to the board, and in some cases can even serve as the main heat sink for the component.

The entire under-fill process is controlled by CNC, which ensures both accuracy and repeatability.

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Specifications

Equipment List

Protects Against		Heat Mechanical Stress Shock Vibration

Available Fills		AR (Acrylic Resins) ER (Epoxy Resins) SR (Silicone Resins) UR (Urethane Resins)

Industries Served		Aerospace Automotive Consumer Electronics Industrial Medical Military Telecom

Compliances		AQMD COMSEC FIPS ISO9001 RoHS

Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - ISO 9001:2000

Ball Grid Array Underfill

Protects Against

Available Fills

Industries Served

Compliances