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Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - ISO 9001:2000

Conformal Coating - Plasma Etchback - Potting - Encapsulation
 
 
Conformal Coating Parylene Deposition Potting/Encapsulation Ball Grid Array Underfill Testing and Laboratory Services Plasma Etchback/Desmear Engineering, Design & Prototyping Security Programs & Secondary Services Plasma Equipment / Repair


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Conformal Coatings

Conformal coatings were created to form a barrier over a finished assembly to protect it against extreme environments, exposure to moisture, salt, electrical leakage, temperature fluctuation, fungus, dust, and other environmental contaminants. We also offer metalized coatings for protection against EMI/RFI.

Parylene Chamber

Parylene Deposition

Plasma Ruggedized Solutions (PRS) offers Parylene (XY) vacuum deposition services. Parylene is a polymer created from a chemical compound known as dimer \ ‘dî-mər\. The dimer is formed by the combination of two molecules of a single chemical compound. Parylene is considered one of the most effective conformal coatings utilized in harsh environments. The vapor deposition polymerization process allows Parylene coatings to be completely uniform in thickness and pin hole free. Parylene is truly conformal. Parylene provides excellent protection for the most extreme environmental conditions.

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Potting/Encapsulating

Potting can ruggedize for extreme environments, provide shock vibration and security of sensitive designs, as well as create a barrier against moisture, fungus, dust, and corrosion. Potting can also enhance circuit reliability by eliminating leakage from high voltage circuits, protecting against arcs and short circuits and by preventing the formation of ‘tin whiskers.'

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Ball Grid Array Underfill

Plasma Ruggedized Solutions can underfill any Ball Grid Array (BGA) components with a variety of encapsulants.

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Testing & Laboratory Services

Plasma Ruggedized Solutions offers a variety of testing services to verify a design, conformance to a given specification or to check for fabrication errors.

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Plasma Etchback & Desmear

‘Desmear’ uses chemical reactions to clean epoxy resin from the inside of drilled holes in PCBs. Etchback is a similar process, but rather than just removing residue, it actually removes some of the substrate surrounding the interconnects.

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Engineering Design & Prototyping

Plasma Ruggedized Solutions offers engineering and design services at every step of the design process.

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Security Programs

Plasma Ruggedized Solutions can make your circuit assembly FIPS-compliant. Used by industries where security is extremely important, such as defense, banking and aerospace, our security programs can make a circuit board assembly protected from unauthorized access or reverse engineering. By covering the assembly with a physical barrier, sensitive data and valuable designs are protected.

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