Conformal coatings were created to form a barrier over a finished assembly to protect it against extreme environments, exposure to moisture, salt, electrical leakage, temperature fluctuation, fungus, dust, and other environmental contaminants. We also offer metalized coatings for protection against EMI/RFI.
Potting can ruggedize for extreme environments, provide shock vibration and security of sensitive designs, as well as create a barrier against moisture, fungus, dust, and corrosion. Potting can also enhance circuit reliability by eliminating leakage from high voltage circuits, protecting against arcs and short circuits and by preventing the formation of ‘tin whiskers.'
Plasma Ruggedized Solutions offers a variety of testing services to verify a design, conformance to a given specification or to check for fabrication errors.
‘Desmear’ uses chemical reactions to clean epoxy resin from the inside of drilled holes in PCBs. Etchback is a similar process, but rather than just removing residue, it actually removes some of the substrate surrounding the interconnects.
Plasma Ruggedized Solutions can make your circuit assembly FIPS-compliant. Used by industries where security is extremely important, such as defense, banking and aerospace, our security programs can make a circuit board assembly protected from unauthorized access or reverse engineering. By covering the assembly with a physical barrier, sensitive data and valuable designs are protected.
